The Honor Magic V4 is expected to be thinner than 9mm, making it one of the thinnest foldable phones when it launches.
Honor is preparing to l
aunch its next foldable phone, the Magic V4, which is expected to be introduce
d in June. According to leak
ed information, the device will be equipped with Qualcomm's Snapdragon 8 El
ite chip, a full-core version, unlike the seven-core version on the Oppo Find N5.
Illustration photo.
Illustration photo.
Several other key details about the Magic V4 have also been revealed, inclu
ding the screen size, camera upgrades, and a slimmer design. While the informatio
n doesn’t name the device, all signs point to it being the Magic V4.
According to tech blogger @DigitalChatStation, the Magic V4 will feature an
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8-inch LTPO internal display with a 120Hz refresh rate and 2K resolution. The external
display will also be LTPO with a 6.45-inch size and the same refresh rate.
In terms of camera, the Magic V4 is expected to retain the 50MP 1/1.5-inch main sensor from its predecessor, the Magic V3. However, a
notable upgrade is the 200MP
hich is superior to the 50MP zoom lens on the Magic V3. Information about another sensor has not been revealed yet.
In addition to the improved camera hardware, the Magic V4 is said to be thinner than 9
mm, potentially making it one of the thinnest foldable phones available today. The Magic
V3 previously held that position until the Oppo Find N5 launched last month. To reclaim the throne, the Magic V4 will need to be even thinner.
Additionally, the phone is rumored to support wireless charging, meet IPX8 water resistance standards, and have satellite communication capabilities. In terms of biometrics, Honor may equip a fingerprint sensor on the side instead of in the screen.
