Leaked information reveals that the Galaxy Z Fold7 and Z Flip7 will have an improved design and effective heat dissipation.
A recent leak has revealed interesting details about the hinge design and cooling system of Samsung 's upcoming Galaxy Z Fold7 and Z Flip7 phones . Both devices are expected to be introduced this summer.
Galaxy Z Fold7 and Z Flip7 will have many design improvements.
According to GSMArena, the Galaxy Z Fold7 and Z Flip7 will have a larger cooling system than previous versions, helping the device operate cooler. In particular, the hinges of these two smartphones promise to be smoother and more durable. The crease on the screen of the Galaxy Z Fold7 is said to be much smaller, although not completely gone.
Both devices will run on One UI 7.1 out of the box, however, it is unclear whether they will be based on Android 15 or Android 16. This is because the new version of Android could be introduced earlier than expected this year, even before the launch of the Galaxy Z Fold7 and Z Flip7.
In addition, the successor to the Z Flip6 is said to have a maximum screen brightness of up to 2,600 nits, while Samsung will also improve the speaker system for the Z Fold7. According to previous leaks, the Galaxy Z Flip7 may use the Exynos 2500 chipset, while the Z Fold7 will be equipped with the Snapdragon 8 Elite SoC.
